Premium
Top‐Down Meets Bottom‐Up: Dip‐Pen Nanolithography and DNA‐Directed Assembly of Nanoscale Electrical Circuits
Author(s) -
Chung SungWook,
Ginger David S.,
Morales Mark W.,
Zhang Zhengfan,
Chandrasekhar Venkat,
Ratner Mark A.,
Mirkin Chad A.
Publication year - 2005
Publication title -
small
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.785
H-Index - 236
eISSN - 1613-6829
pISSN - 1613-6810
DOI - 10.1002/smll.200400005
Subject(s) - nanolithography , nanoscopic scale , dip pen nanolithography , nanotechnology , materials science , nanoparticle , electronic circuit , oligonucleotide , electrode , self assembly , lithography , optoelectronics , dna , fabrication , chemistry , physics , biochemistry , medicine , alternative medicine , pathology , quantum mechanics
Nanoscale electrode junctions have been selectively functionalized with specific oligonucleotide sequences using dip‐pen nanolithography (see picture). These sequences direct the assembly of electrical circuits containing 20‐ and 30‐nm‐diameter DNA‐modified nanoparticles so that junctions bridged by single nanoparticles can be realized. Different nanoparticle types can be directed to specific junctions on a single chip through solution‐phase bottom‐up assembly.