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A Phthalonitrile Resin with a Low Melting Point and High Storage Modulus Containing High‐Density Aromatic Ether Bonds
Author(s) -
Shi Xiaoyu,
Bai Shengnan,
Ji Puguang,
Naito Kimiyoshi,
Yu Xiaoyan,
Zhang Qingxin
Publication year - 2020
Publication title -
chemistryselect
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.437
H-Index - 34
ISSN - 2365-6549
DOI - 10.1002/slct.202002755
Subject(s) - phthalonitrile , dynamic mechanical analysis , glass transition , curing (chemistry) , monomer , polymer chemistry , melting point , materials science , fourier transform infrared spectroscopy , polymerization , differential scanning calorimetry , prepolymer , phenylene , polymer , terephthaloyl chloride , chemical engineering , composite material , condensation polymer , phthalocyanine , nanotechnology , physics , polyurethane , engineering , thermodynamics
A low melting point phthalonitrile monomer named 4,4′‐2‐cyano‐1,3‐phenylene)bis(oxy))bis(4,1‐phenylene))bis(oxy))bis(4,1‐phenylene))bis(oxy))diphthalonitrile (BOPN), was synthesized by nucleophilic substitution of 4,4′‐oxydiphenol with 2,6‐dichlorobenzonitrile. The BOPN resin containing high‐density aromatic ether bonds were prepared via bulk addition polymerization. Two kinds of polymers were prepared from BOPN monomer by using 4‐(aminophenoxy)phthalonitrile (APPH) as the curing agent under different curing procedures. The chemical structure of the monomer was determined by Nuclear Magnetic Resonance spectroscopy (NMR) and Fourier Transform Infrared spectroscopy (FTIR). Dynamic Mechanical Analysis (DMA) demonstrated that the storage modulus of the resin at room temperature was 3712 MPa and the glass transition temperature was above 400 °C. Differential Scanning Calorimetric (DSC) analysis and rheological test indicated that the melting point and processing window of the monomer were 92 °C and 118 °C, respectively. The temperature for 95 % weight retention of the polymer in air was 529 °C.