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Electrochemical Fabrication of Copper and Tin Micro‐Crystals from a Protic Ionic Liquid Medium
Author(s) -
Bhujbal Akshay Vilas,
Rout Alok,
Venkatesan Konda A.,
Bhanage Bhalchandra M.
Publication year - 2020
Publication title -
chemistryselect
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.437
H-Index - 34
ISSN - 2365-6549
DOI - 10.1002/slct.202000714
Subject(s) - tin , ionic liquid , electrochemistry , copper , fabrication , materials science , ionic bonding , inorganic chemistry , chemical engineering , nanotechnology , metallurgy , chemistry , electrode , ion , organic chemistry , alternative medicine , pathology , engineering , catalysis , medicine
New protic ionic liquid, namely 1‐Methylpiperidinium trifluoromethane sulphonate [HmPip][OTf] was synthesized and employed for the dissolution of Cu and Sn metal precursors followed by the electrodeposition process of the subsequent metals. The cyclic voltammogram of [HmPip][OTf], CuCl 2 (80 mM) in [HmPip][OTf] and SnCl 2 (65 mM) in [HmPip][OTf] phase recorded at glassy carbon electrode (working electrode), with the glassy carbon as counter and platinum as the reference electrode. The CV indicates that Cu 2+ underwent two‐step one‐electron transfer, whereas Sn 2+ reduced via one step two‐electron transfer. The diffusion coefficient of Cu 1+ , Cu 2+ and Sn 2+ ions in [HmPip][OTf] phase were evaluated by the CV method. The experimental temperature and the scan rate were set at 353 K and 110 mV/s respectively. Electrodeposition of Cu and Sn was done at their corresponding reduction potential determined from cyclic voltammetry. Spectroscopic investigation of the deposits obtained after electrodeposition is done by SEM‐EDX as well as XRD.