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Synthesis and Properties of a Silicon‐Containing Arylacetylene Resin with 2,6‐Diphenoxypyridine Unit
Author(s) -
Ma Manping,
Li Chuan,
Liu Xiaotian,
Yuan Qiaolong,
Huang Farong
Publication year - 2020
Publication title -
chemistryselect
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.437
H-Index - 34
ISSN - 2365-6549
DOI - 10.1002/slct.201902444
Subject(s) - materials science , thermal stability , dielectric loss , dielectric , composite material , flexural strength , ethylene , silicon , polymer chemistry , organic chemistry , chemistry , catalysis , optoelectronics , metallurgy
A novel silicon‐containing arylacetylene resin called poly(dimethylsilylene‐ethylene‐phenoxypyridyloxy‐phenylene‐ethylene) (PSPPY) was made from 2,6‐bis(4‐ethynyl‐phenoxy) pyridine and dimethyldichlorosilane by Grignard reactions. The structure and properties of the resin were characterized by 1 H‐NMR, FT‐IR, GPC, XRD, DSC, TGA and universal testing machine. The resin has a wide processing window ranged from 35 °C to 155 °C. The cured resin shows excellent mechanical property, low dielectric property and high thermal stability. The flexural strength of the cured resin at room temperature reaches 58.7 MPa. The cured resin has dielectric constant 3.0–3.5, dielectric loss 0.008‐0.040 in the frequency of 10 −1 ‐10 6 Hz, and low water uptake (0.8 %). The degradation temperature at 5 % weight loss and the residue at 800 °C of the cured resin arrive at 500 °C and 77.1 % in nitrogen atmosphere, respectively.