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Synthesis of Cu x S Thin Films with Tunable Localized Surface Plasmon Resonances
Author(s) -
Kalanur Shankara S,
Seo Hyungtak
Publication year - 2018
Publication title -
chemistryselect
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.437
H-Index - 34
ISSN - 2365-6549
DOI - 10.1002/slct.201800441
Subject(s) - covellite , x ray photoelectron spectroscopy , copper , thin film , surface plasmon resonance , materials science , intercalation (chemistry) , copper sulfide , lattice constant , analytical chemistry (journal) , absorption edge , thiosulfate , plasmon , chalcocite , valence (chemistry) , crystallography , inorganic chemistry , chemistry , nanotechnology , band gap , nanoparticle , optics , optoelectronics , chalcopyrite , chemical engineering , sulfur , metallurgy , physics , chromatography , organic chemistry , diffraction , engineering
In this work, we report the fabrication of copper sulfide (CuS, Cu 1.39 S, and Cu 2 S) thin films with tunable localized surface plasmon resonance (LSPR). The thin films were synthesized by keeping the Cu precursor concentration constant and varying that of sodium thiosulfate, which dictated the final Cu x S product. CuS showed the highest intensity LSPR peak and its intensity decreased with the increasing incorporation of Cu, as in the case of Cu 1.39 S, and vanished for the Cu‐rich Cu 2 S, indicating carrier concentration‐dependent plasmonic absorption. The shift in the XRD peak positions towards a lower degree and the increase in the d‐spacing values for CuS indicated the intercalation of Cu species in the initial covellite lattice, yielding Cu 1.39 S and Cu 2 S in the process. XPS valence band edge studies revealed that among the synthesized Cu x S thin films, CuS showed a stronger p‐type as compared to Cu 1.39 S and Cu 2 S.