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Effects of Sodium Hydroxyethyl Sulfonate on Improving the Ductility of the Copper Films Deposited by Electroless Plating from High‐Speed Plating Baths
Author(s) -
Wu Minxian,
Xu Chao,
Wang Wenchang,
Mitsuzaki Naotoshi,
Chen Zhidong
Publication year - 2018
Publication title -
chemistryselect
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.437
H-Index - 34
ISSN - 2365-6549
DOI - 10.1002/slct.201702385
Subject(s) - sulfonate , copper , ductility (earth science) , materials science , sodium , pulmonary surfactant , plating (geology) , copper plating , stress (linguistics) , composite material , metallurgy , chemical engineering , layer (electronics) , electroplating , linguistics , creep , philosophy , geophysics , engineering , geology
The copper films that electroless plated from the formaldehyde‐based solutions frequently suffer from the internal stress. The internal stress leads to a poor ductility of the plated films. To lower internal stress and improve ductility of copper films, sodium hydroxyethyl sulfonate was used as a surfactant to promote the detachment of hydrogen bubbles. The folding tests showed that the copper film deposited from the solution containing 3 mL L −1 25% sodium hydroxyethyl sulfonate (EHS) had the best ductility. The internal stresses of the copper films were measured using X‐ray diffraction technique and the stress decreased from 100 MPa to 30 MPa as the EHS concentration increased from 0 to 3 mL L −1 . Sodium hydroxyethyl sulfonate had little influence on the film morphology and crystal size. High plating rates (> 8 μm h −1 ) were obtained from the solution containing sodium hydroxyethyl sulfonate.