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Influence of formulation chemistry on the locus of failure of adhesive joints
Author(s) -
Taylor A. M.,
McLean C. H.,
Charlton M.,
Watts J. F.
Publication year - 1995
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.740230511
Subject(s) - methacrylate , polymer , acrylate polymer , ceramic , durability , adhesive , overlayer , monomer , materials science , silicon , substrate (aquarium) , chemical engineering , composite material , epoxy , molecule , polymer chemistry , layer (electronics) , chemistry , acrylate , organic chemistry , oceanography , engineering , geology
Abstract The durability of photocured resins adhered to ceramic substrates has been investigated. Monochromated XPS and time‐of‐flight SIMS were employed to determine the precise locus of failure in butt‐joints comprised of a photocured resin adhered to either a 96% pure, debased alumina substrate or single‐crystal silicon. Prolonged (> 14 days) immersion in water at 50°C resulted in cohesive failure, with 1–2 nm of polymer remaining on one of the ceramic substrates. An absence in the spectrum of any components attributable to characteristic groups from a major constituent of the polymer within this overlayer suggested the possibility that one of the minor resin components was aggregating at the organic/inorganic interface to produce an in situ weak boundary layer. The interactions of some of the organic molecules present in the formulation with the α‐alumina substrate were investigated using molecular modelling techniques to indicate the most favourable interactions with the substrate. Durability studies were also carried out on a reformulated photocured resin to investigate the effect of removal of the ethoxylated methacrylate monomer, suspected of being the principal organic component at the weak boundary layer, on both joint performance and locus of failure.