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Interfacial layers and adhesion in the moulding of nitrile rubber
Author(s) -
Lotfipour M.,
Packham D. E.,
Turner D. M.
Publication year - 1991
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.740170719
Subject(s) - nitrile rubber , adhesion , natural rubber , x ray photoelectron spectroscopy , rheometer , composite material , materials science , paint adhesion testing , layer (electronics) , nitrile , polymer , polymerization , tearing , injection moulding , chemical engineering , chemistry , rheology , organic chemistry , engineering
The mould release of rubber gives a good example of circumstances where a consistent but low level of adhesion is of importance. In this paper, XPS work on mould release of rubber is described, and the influences on the adhesion of nitrile rubber to moulds are discussed. Two tests of adhesion have been developed, the ‘TMS’ rheometer and the blister test. XPS has been used to characterize the interfaces after separation. The fracture path during demoulding is close to the interface between the alloy and the polymer, within a layer consisting of residues such as coagulants and emulsifiers from the initial polymerization. Thus, the level of adhesion depends upon the nature of this layer formed at the interface during moulding.