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Surface analysis preparations for multilayer plated through‐holes
Author(s) -
Love Brian J.
Publication year - 1989
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.740141117
Subject(s) - soldering , foil method , surface (topology) , materials science , electrical conductor , embedding , printed circuit board , auger , composite material , optoelectronics , mechanical engineering , computer science , electrical engineering , engineering , geometry , mathematics , artificial intelligence
Surface analysis on multilayer printed wiring board interconnections has been, at best, difficult to achieve. This has been primarily related to geometric considerations, which prevent adequate detection of x‐rays, Auger emissions, etc. We have developed a method for analysing solder defects on plated through‐holes via a microsectioning technique to generate a coupon and then embedding the coupon in conductive foil for analysis. Samples are shown that have been produced using this technique. Reasonable spectra have been generated on specimens prepared by this technique. This preparation allows analysis on soldered holes, which, because of geometric constraints, are difficult to analyse.