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Surface analysis of Ti6Al4V adhesive bonding systems
Author(s) -
Clearfield H. M.,
Cote G. O.,
Olver K. A.,
Shaffer D. K.,
Ahearn J. S.
Publication year - 1988
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.740110613
Subject(s) - x ray photoelectron spectroscopy , adhesive , materials science , auger , titanium , layer (electronics) , etching (microfabrication) , adhesive bonding , composite material , surface (topology) , surface finish , analytical chemistry (journal) , chemical engineering , metallurgy , chemistry , geometry , physics , mathematics , atomic physics , chromatography , engineering
Titanium surfaces that have been prepared for adhesive bonding are difficult to characterize because they exhibit micro‐rough and, in some cases, macro‐rough morphologies, Errors can arise in the interpretation of sputter depth profiles obtained from such surfaces dur to the analysis geometry, i.e. large sampling probes and shadowing of the ion etching beam. This can be avoided either by scanning Auger microscopy or by x‐ray photoelectron spectroscopy to obtain estimates of the surface layer composition and thickness. We illustrate the utility of both techniques by studying the mechanisms of failure in adhesive bonds formed at Ti6Al4V surfaces before and after exposure to air at 330°C for 165 hours.

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