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Interfacial chemistry at real resin–metal interfaces of electronics devices
Author(s) -
Pignataro S.,
Torrisi A.,
Ferla G.
Publication year - 1985
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.740070305
Subject(s) - epoxy , metal , composite material , chemical reaction , materials science , chemical state , chemical composition , chemistry , chemical engineering , x ray photoelectron spectroscopy , organic chemistry , metallurgy , engineering
An amine and an anhydride cured commercial epoxy resin were moulded to real Ag, Ni and Cu surfaces in plant conditions. The joints were mechanically broken and the two faces obtained in the fracture analysed by ESCA. The interfacial chemical compositions were found to be different with respect to that of the corresponding resin and metal bulk. Some of the resin constituents were confined in the bulk of the resin itself. Others were found to be homogeneously distributed between the bulk of the resin and the interface. Another group of resin constituents were found to segregate to the interfacial zone, often in a chemical state different from that found in the bulk. Also some trace elements present as additives in the metals were found to migrate to the interfacial zone. The migration phenomena were found to selectively depend on the chemical nature of the metal and resin respectively. Dramatic chemical composition differences were found between the two faces obtained in the fracture. The effect of time and moulding temperature on the interfacial chemistry was studied. Proof of various chemical reactions taking place at the interfaces with time or moulding temperature could be obtained. The results are discussed also in terms of performance of the electronic devices where the studied interfaces are present.