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Soft x‐ray appearance‐potential study of Ti–Ni system
Author(s) -
Hatwar T. K.,
Chopra D.
Publication year - 1985
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.740070207
Subject(s) - binding energy , conduction band , fermi level , materials science , full width at half maximum , spectroscopy , analytical chemistry (journal) , atomic physics , chemistry , molecular physics , electron , physics , optoelectronics , quantum mechanics , chromatography
Soft x‐ray appearance‐potential spectroscopy (SXAPS) probes the binding energies of the core levels and local unoccupied conduction‐band states of solid surfaces. This technique has been exploited to study the electronic structure of Ti–Ni alloys of atomic composition Ti x Ni 1– x where x = 0, 0.3, 0.5, 0.7, 1.0. The measured full width at half maximum (FWHM) of the Ti L 3 peak systematically decreases with increasing Ni content while the Ni L 3 peak shows a corresponding decrease. The binding energies of both constituents shift towards higher energy as a result of Fermi level shift and charge transfer from Ti to Ni. These measurements are in agreement with the common‐band model for these alloys.