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Angular distribution of particles sputtered from a copper target by 5‐keV Kr ions: Experiment and simulation study
Author(s) -
Afkir Ahmed,
Ait El Fqih Mohammed,
Jadoual Lamia,
Shulga Vladimir,
Kaddouri Abdelilah
Publication year - 2021
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.6980
Subject(s) - copper , materials science , scattering , atomic physics , irradiation , surface roughness , ion , foil method , surface finish , sputtering , transmission electron microscopy , optics , spectroscopy , analytical chemistry (journal) , chemistry , physics , thin film , metallurgy , nanotechnology , composite material , nuclear physics , organic chemistry , chromatography , quantum mechanics
Angular distributions of atoms sputtered from a copper target under 5‐keV Kr + bombardment at normal incidence were simultaneously and independently studied by experiments and computer simulation. The sputtered particles are collected on a Mylar™ foil placed around the target. Deposited particles on the substrate were analyzed by optical transmission spectroscopy. The surface roughness of the irradiated target was studied by atomic force microscopy, surface profilometry, and scanning electron microscopy. The experimental results were compared with the simulated angular distributions (programs OKSANA, SDTrimSP, and SRIM) and were found to be in reasonable agreement. In all cases, the angular distribution of sputtered particles showed an over‐cosine shape, which may be associated with noncompensated scattering of ejected particles by surface atoms when exiting the target. The results obtained are compared with the data from the literature.