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Formation of triazole inhibitive film on copper surface by click assembly in presence of Cu 2 S quantum dots
Author(s) -
Gao Lixin,
Wu Panpan,
Zhang Kai,
Li Jin,
Zhang Daquan
Publication year - 2021
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.6979
Subject(s) - click chemistry , copper , triazole , azide , chemistry , electrochemistry , materials science , chemical engineering , polymer chemistry , organic chemistry , electrode , engineering
The triazole inhibitive film was assembled on copper surface via the click reaction between p ‐toluenesulfonyl azide (TA) and propiolic acid (PA) in presence of Cu 2 S quantum dots (CuDs). The click‐assembled film on copper surface has good anticorrosion property in 3 wt.% NaCl solution. The best protective efficiency is 93.7%. The role of CuDs for the click assembly is investigated by the spectral analysis, electrochemical measurements, and surface morphology characterization. The Cu(I) in CuDs exhibited good thermodynamic stability and catalytic activity. During the assembly process, CuDs become the new interface of the click reaction and facilitate the formation of the triazole inhibitive film on copper surface.