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Corrosion resistance of Cu‐bearing 316L stainless steel tuned by various passivation potentials
Author(s) -
Zhang Hongzhen,
Zhao Jinlong,
Yang Chunguang,
Shen Minggang,
Zhang Xinrui,
Xi Tong,
Yin Lu,
Zhao Hanyu,
Liu Xiaofang,
Liu Lichu,
Yang Ke
Publication year - 2021
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.6946
Subject(s) - passivation , x ray photoelectron spectroscopy , corrosion , materials science , dielectric spectroscopy , passivity , dissolution , metallurgy , layer (electronics) , electrochemistry , naringin , analytical chemistry (journal) , chemical engineering , electrode , composite material , chemistry , electrical engineering , chromatography , engineering
Three incremental passivation potentials (0.2, 0.5, and 0.8 V SCE ) were selected to passivate the 316L‐Cu stainless steel (SS) and the 316L SS in 0.5 M H 2 SO 4 solution, with the aim to investigate the corrosion resistance differences of two SSs in 0.9 wt.% NaCl solution. Various electrochemical tests including potentiodynamic polarization, electrochemical impedance spectroscopy (EIS), and Mott–Schottky analytical method assisted with X‐ray photoelectron spectroscopy (XPS) were employed. The results indicated that 316L‐Cu SS after passivation in 0.5 M H 2 SO 4 solution showed no influence on the double‐layer structure of passive films. Besides, increased passivation potential augmented the electron donor concentration ( N D ) and the hole accepter concentration ( N A ) of the passive film on the 316L‐Cu SS, hinting a gradually declined compactness of the passive film. EIS results further affirmed that the passive film stability of 316L‐Cu SS followed the same tendency with increased passivation potential. XPS results hinted that the oxidation reaction of Cu element switching into Cu 2+ and Cu + ions promoted the dissolution of Cu ions and weakened the passive film stability of 316L‐Cu SS.