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Solvent‐induced surface instability of thin metal films on a polymer substrate
Author(s) -
Xue Xiuli,
Wang Shibin,
Zeng Chaofeng,
Li Linan,
Li Chuanwei
Publication year - 2018
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.6356
Subject(s) - buckling , delamination (geology) , materials science , thin film , substrate (aquarium) , composite material , adhesion , polymer , solvent , instability , optical microscope , metal , stress (linguistics) , nanotechnology , scanning electron microscope , chemistry , metallurgy , organic chemistry , biology , mechanics , subduction , paleontology , oceanography , physics , geology , tectonics , linguistics , philosophy
The solvent‐provoked formation and evolution of thin film buckling‐delamination on a compliant substrate have been studied. The film surface is observed by an optical microscope showing a remarkable dynamic buckling‐delamination development and a subsequent stable branched‐straight state. It is revealed that the initiation, propagation, and the resulting patterns of film buckles are strongly dependent on the solvent type, film stress, interfacial adhesion, and film thickness. The buckling could be controlled further by a reasonable chemical solvent configuration and used to provide useful information for the pattern creation on polymer systems in diverse fields, such as micro/nanofabrication and optics.