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In‐situ stress suppression of hydrogenated a‐CN x film prepared via Ar gas introduction
Author(s) -
Wang Qi,
He Deyan,
Zhang Junyan
Publication year - 2017
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.6140
Subject(s) - graphite , materials science , microstructure , nitrogen , compressive strength , amorphous solid , nitride , analytical chemistry (journal) , amorphous carbon , composite material , stress (linguistics) , deposition (geology) , carbon film , carbon nitride , thin film , chemistry , nanotechnology , crystallography , layer (electronics) , organic chemistry , paleontology , linguistics , philosophy , photocatalysis , sediment , biology , catalysis
Evolution of hydrogenated amorphous carbon nitride films was investigated with an introduction of Ar gas in the deposition. The results showed that compressive stress of the films decreased versus an increase of Ar flow rate. Especially, at an Ar flow rate of 5 sccm the film exhibited lower compressive stress, higher hardness and lower root‐mean‐square (rms) roughness than the films deposited without Ar gas introduction. Structural analysis showed that the films with higher hardness, low compressive stress and lower rms roughness had relatively high sp 2 and nitrogen content. It was attributed to the assistance of Ar plasma, which can cause N atom to enter graphite ring easily and form curved graphite microstructure. Copyright © 2016 John Wiley & Sons, Ltd.