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Influence of bath temperatures on the wettability of copper films surface prepared by electroless plating method on beech wood
Author(s) -
Amer Jamal,
Mrad Omar,
Naddaf Munzer
Publication year - 2016
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.6034
Subject(s) - copper , x ray photoelectron spectroscopy , wetting , contact angle , scanning electron microscope , raman spectroscopy , materials science , analytical chemistry (journal) , chemical engineering , plating (geology) , energy dispersive x ray spectroscopy , metallurgy , chemistry , composite material , optics , organic chemistry , physics , geophysics , engineering , geology
Copper films were coated on beech wood substrates by electroless plating method. The influence of bath temperature on the copper films properties was studied by varying the bath temperatures 25, 35, 45 and 55 °C. Scanning electron microscopy (SEM) equipped with energy dispersive spectroscopy (EDS), X‐ray diffraction (XRD) pattern, X‐ray photoelectron spectroscopy (XPS), micro Raman spectroscopy and contact angle measurements were used to both characterize the physical and chemical copper films properties and understand the influence of bath temperature on the wettability of copper surface. In our studies, we have found that the gained copper mass significantly increased at 55 °C. The crystalline nature of the coated copper was confirmed by XRD. The presence of Cu 2 O and CuO was observed by XPS and micro Raman techniques, which confirms the oxidization of the coated copper surface. Also these characterization techniques have shown the big influence of bath temperature on the morphology, grain size, chemical composition and the film thickness of the coated copper. The wettability was highly influenced by increasing CuO on the coated copper, which is increased by the bath temperature. The contact angle measurements have demonstrated the influence of C―O, O―CO and CuO components of the surface on the wettability of the samples. Copyright © 2016 John Wiley & Sons, Ltd.