XPS analyses on Ta/Au/NiFe/NiO/Ta films | Zendy

Li Minghua | Zendy; Yang Kang | Zendy; Zhang Min | Zendy; Liu Yang | Zendy; Ding Lei | Zendy; Teng Jiao | Zendy; Yu Guanghua | Zendy

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XPS analyses on Ta/Au/NiFe/NiO/Ta films

Author(s) -

Li Minghua,

Yang Kang,

Zhang Min,

Liu Yang,

Ding Lei,

Teng Jiao,

Yu Guanghua

Publication year - 2015

Publication title -

surface and interface analysis

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.52

H-Index - 90

eISSN - 1096-9918

pISSN - 0142-2421

DOI - 10.1002/sia.5745

Subject(s) - non blocking i/o , x ray photoelectron spectroscopy , materials science , layer (electronics) , sputtering , sputter deposition , metallurgy , analytical chemistry (journal) , thin film , chemical engineering , nanotechnology , chemistry , catalysis , biochemistry , chromatography , engineering

In this study, Ta/NiFe/NiO/Ta films were prepared by magnetron sputtering. The Au layer inserted at the interface of Ta and NiFe significantly influences the exchange bias field (H ex ) of the Ta/NiFe/NiO/Ta films. The Hex of the film with 0.9 nm Au layer increased by 28% compared with that of the film without a Au layer. The results show that the Au layer inserted at the interface of Ta and NiFe segregated at the surface of the NiFe/NiO in Ta/Au/NiFe/NiO/Ta films. The Au layer insulated the direct contact and suppressed the interface reaction between the NiFe and NiO layers, thus increasing the Hex. Copyright © 2015 John Wiley & Sons, Ltd.

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