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XPS analyses on Ta/Au/NiFe/NiO/Ta films
Author(s) -
Li Minghua,
Yang Kang,
Zhang Min,
Liu Yang,
Ding Lei,
Teng Jiao,
Yu Guanghua
Publication year - 2015
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.5745
Subject(s) - non blocking i/o , x ray photoelectron spectroscopy , materials science , layer (electronics) , sputtering , sputter deposition , metallurgy , analytical chemistry (journal) , thin film , chemical engineering , nanotechnology , chemistry , catalysis , biochemistry , chromatography , engineering
In this study, Ta/NiFe/NiO/Ta films were prepared by magnetron sputtering. The Au layer inserted at the interface of Ta and NiFe significantly influences the exchange bias field (H ex ) of the Ta/NiFe/NiO/Ta films. The Hex of the film with 0.9 nm Au layer increased by 28% compared with that of the film without a Au layer. The results show that the Au layer inserted at the interface of Ta and NiFe segregated at the surface of the NiFe/NiO in Ta/Au/NiFe/NiO/Ta films. The Au layer insulated the direct contact and suppressed the interface reaction between the NiFe and NiO layers, thus increasing the Hex. Copyright © 2015 John Wiley & Sons, Ltd.