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Microstructure characteristics and shear properties of welding bonding of W/Al dissimilar metals with copper transitional layer
Author(s) -
Chen Jie,
Wang Kehong,
Zhu Heguo
Publication year - 2013
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.5179
Subject(s) - materials science , copper , intermetallic , microstructure , welding , metallurgy , tungsten , eutectic system , scanning electron microscope , atmospheric temperature range , aluminium , layer (electronics) , composite material , alloy , thermodynamics , physics
Commercial pure wrought tungsten and 1060 pure aluminum can be joined by using induction‐heat deposition (IHD) welding with commercial pure copper transitional layer. The microstructures of W/Cu/Al interfaces have been studied by means of scanning electron microscope, energy dispersive X‐ray, and X‐ray diffraction. Results show that copper as the transitional metal could form good interfaces with both tungsten and aluminum by IHD under proper processing parameters. The metallic bonding of W/Cu obtained by Cu and W mutual diffusing at a quite limited range without any intermetallic compounds, while eutectic of α(Al)/θ(CuAl 2 ) makes up Cu/Al interface. The average shear strength of W/Cu and Cu/Al interfaces are about 170 MPa and 55 Mpa, respectively, at room temperature. Copyright © 2012 John Wiley & Sons, Ltd.