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Interfacial Studies for improving the adhesion of Cr/Al films on composites
Author(s) -
Zhao DongCai,
Xiao GengJie,
Ren Ni,
Ma ZhanJi,
Wu ShengHu
Publication year - 2011
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.3729
Subject(s) - composite material , materials science , electrical resistivity and conductivity , composite number , adhesion , substrate (aquarium) , x ray photoelectron spectroscopy , aluminium , layer (electronics) , profilometer , surface finish , chemical engineering , oceanography , geology , electrical engineering , engineering
The composites, such as CFRP and GFRP, have been widely applied in spaceflight, for their low specific gravity, low cost, and additional structural stability. However, the high resistivity of the composites severely inhibits their further applications. Therefore, Cr/Al films with low resistivity and high adhesion were deposited on composites by cathodic arc technique. The films were characterized by pull test, Dektak 8 Stylus Profilometer, SEM, XPS, XRD and Z‐82 standard four probes. Results show that the aluminum film of fcc structure is compact and uniform, with resistivity as low as bulk Al. The adhesion between Cr buffer layer and composite substrate was greatly enhanced because of the formation of the chemical bonds, such as CrC, CrO and CrN, at the Cr/composite interface. Copyright © 2011 John Wiley & Sons, Ltd.