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Preparation and tribological properties of self‐assembled poly(amide amine)‐Cu nanofilm on silicon
Author(s) -
Cui Baofeng,
Zhang Ling,
Zhou Huidi,
Zhang Junyan,
Chen Jianmin
Publication year - 2011
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.3726
Subject(s) - materials science , monolayer , x ray photoelectron spectroscopy , tribology , amine gas treating , amide , contact angle , silicon , lubrication , self assembled monolayer , chemical engineering , dendrimer , copper , polymer chemistry , composite material , atomic force microscopy , friction coefficient , nanotechnology , organic chemistry , chemistry , metallurgy , engineering
Self‐assembled poly(amide amine)‐copper (PAMAM/Cu) film on silicon was prepared and investigated by means of contact angle measurement, XPS and atomic force microscopy (AFM). The tribological properties were evaluated using a reciprocal ball‐on‐disc test rig and a lateral force microscope. Results of XPS show the existence of Cu(0) and PAMAM molecule on the surface of the film. Compared with the self‐assembled monolayer of the poly(amide amine) generation 4.0 dendrimer, the friction force of PAMAM/Cu film is lower and the friction coefficient is smaller which can be attributed to the existence of Cu nanoparticles. The PAMAM/Cu film shows a good lubrication effect. The stability of friction and wear resistance of film is improved. Copyright © 2011 John Wiley & Sons, Ltd.