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Proposed ToF‐SIMS/XPS standardization methods for bonding wires in electronic packaging applications
Author(s) -
Sodhi R.,
Gallaugher M.,
Wang Z.,
Koo J.
Publication year - 2010
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.3634
Subject(s) - x ray photoelectron spectroscopy , standardization , wire bonding , secondary ion mass spectrometry , characterization (materials science) , materials science , mass spectrometry , analytical chemistry (journal) , nanotechnology , computer science , chemistry , engineering , chemical engineering , telecommunications , chip , chromatography , operating system
Time of Flight Secondary Ion Mass Spectrometry (ToF‐SIMS) and XPS were utilized to assess the surface characteristics of the bonding wire generally used in electronic packaging applications. This paper outlines the proposed standard methodologies for the analysis of the high‐curvature surfaces of the fine bonding wires (less than 1.2 mil (30 micron) in diameter) using specially designed stages and systematic data acquisition and analysis. Examples are given to showcase the effectiveness of the methodology, which is able to differentiate various industrial process residues and contaminants on the bonding wire. A preliminary draft of the proposed standard surface characterization methods is presented. Copyright © 2010 John Wiley & Sons, Ltd.