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Enhancement of composite‐metal interfacial adhesion strength by dendrimer
Author(s) -
Mei Lei,
He Xiaodong,
Li Yibin,
Peng Qingyu,
Wang Rongguo,
Xu Jian
Publication year - 2011
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.3560
Subject(s) - dendrimer , epoxy , amidoamine , materials science , adsorption , adhesion , metal , composite number , layer (electronics) , composite material , poly(amidoamine) , polymer , chemical engineering , sonication , polymer chemistry , chemistry , organic chemistry , metallurgy , engineering
The interface between carbon fiber reinforced polymer composites and metal plays a critical role in determining the strength of epoxy/metal laminated composites. We propose to introduce one dendrimer layer into the epoxy/metal interface, aiming to enhance the interfacial adhesion strength so that the interface could more effectively transfer the load from epoxy to metal. In this paper, the preparation and adsorption of dendrimer layer onto the alumina surface were systematically investigated. The results show that a highly stable and nanopatterned dendrimers layer was dip‐coated onto alumina substrates by adsorbing poly (amidoamine) dendrimers. It was confirmed that the dendrimers were adsorbed onto the alumina via acid‐base chemical interactions. The adsorption depends on the reaction time. The adhesion property between dendrimers and alumina was examined by sonication method. Copyright © 2010 John Wiley & Sons, Ltd.