Some surface and interface characterization and metrology requirements in the wafer processing industry | Zendy

Brundle C. R. | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Premium

Some surface and interface characterization and metrology requirements in the wafer processing industry

Author(s) -

Brundle C. R.

Publication year - 2010

Publication title -

surface and interface analysis

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.52

H-Index - 90

eISSN - 1096-9918

pISSN - 0142-2421

DOI - 10.1002/sia.3499

Subject(s) - wafer , characterization (materials science) , metrology , interface (matter) , x ray photoelectron spectroscopy , nanotechnology , surface (topology) , surface metrology , materials science , engineering physics , thin film , computer science , systems engineering , engineering , optics , physics , composite material , chemical engineering , surface finish , mathematics , capillary number , capillary action , profilometer , geometry

With the rapid decrease in thickness of deposited layers during silicon wafer processing, there has been a parallel increase in the use of surface/interface materials analysis techniques. There is now little distinction between surface/interface and thin film analysis when films are only a few nm thick. This brief review presents some of the general concepts and needs for both materials characterization and metrology; some of the current requirements these needs impose on analytical methods; and briefly reviews the status of a few of the techniques better known to the surface/interface analysis community, particularly XPS. Copyright © 2010 John Wiley & Sons, Ltd.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here

Accelerating Research