Molecular depth profiling of polystyrene by electrospray droplet impact | Zendy

Sakai Yuji | Zendy; Iijima Yoshitoki | Zendy; Mukou Souichirou | Zendy; Hiraoka Kenzo | Zendy

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Molecular depth profiling of polystyrene by electrospray droplet impact

Author(s) -

Sakai Yuji,

Iijima Yoshitoki,

Mukou Souichirou,

Hiraoka Kenzo

Publication year - 2011

Publication title -

surface and interface analysis

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.52

H-Index - 90

eISSN - 1096-9918

pISSN - 0142-2421

DOI - 10.1002/sia.3490

Subject(s) - polystyrene , wafer , etching (microfabrication) , polymer , electrospray , silicon , analytical chemistry (journal) , chemistry , x ray photoelectron spectroscopy , materials science , mass spectrometry , chemical engineering , nanotechnology , optoelectronics , composite material , chromatography , engineering , layer (electronics)

The molecular depth profiling of polymer by the electrospray droplet impact (EDI) has been performed. The multiply charged water droplets with kinetic energy of ∼10 6 eV were irradiated on the polystyrene spin coated on silicon wafer. With EDI etching, the ablation of the target is suppressed to a minimal, i.e. the shallow surface etching with nonrecognizable damage on the surface is realized. It was found that EDI/SIMS spectra and EDI/XPS spectra for polystyrene (PS) has shown no damage accumulation on the surface. This indicates that EDI is a unique technique for surface etching of polymer materials without causing any damage to the etched surface. Copyright © 2010 John Wiley & Sons, Ltd.

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