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Molecular depth profiling of polystyrene by electrospray droplet impact
Author(s) -
Sakai Yuji,
Iijima Yoshitoki,
Mukou Souichirou,
Hiraoka Kenzo
Publication year - 2011
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.3490
Subject(s) - polystyrene , wafer , etching (microfabrication) , polymer , electrospray , silicon , analytical chemistry (journal) , chemistry , x ray photoelectron spectroscopy , materials science , mass spectrometry , chemical engineering , nanotechnology , optoelectronics , composite material , chromatography , engineering , layer (electronics)
The molecular depth profiling of polymer by the electrospray droplet impact (EDI) has been performed. The multiply charged water droplets with kinetic energy of ∼10 6 eV were irradiated on the polystyrene spin coated on silicon wafer. With EDI etching, the ablation of the target is suppressed to a minimal, i.e. the shallow surface etching with nonrecognizable damage on the surface is realized. It was found that EDI/SIMS spectra and EDI/XPS spectra for polystyrene (PS) has shown no damage accumulation on the surface. This indicates that EDI is a unique technique for surface etching of polymer materials without causing any damage to the etched surface. Copyright © 2010 John Wiley & Sons, Ltd.