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Failure analysis of fine Cu patterning by shave‐off profiling
Author(s) -
Nojima M.,
Fujii M.,
Kakuhara Y.,
Tsuchiya H.,
Kameyama A.,
Yokogawa S.,
Owari M.,
Nihei Y.
Publication year - 2011
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.3396
Subject(s) - chip , profiling (computer programming) , nanotechnology , materials science , chemistry , computer science , telecommunications , operating system
We focused on failure within fine copper patterning on a semiconductor chip. Three grades of samples were prepared; hard CMP treatment, soft CMP treatment and standard, and compared the differences by shave‐off profiling. The shave‐off profiles of CMP treatment revealed a saw‐toothed structure, and the shave‐off profile of a standard chip was revealed as a periodic triangular wave. The difference can be explained by the existence of residue on the CMP process. Copyright © 2010 John Wiley & Sons, Ltd.