Failure analysis of fine Cu patterning by shave‐off profiling | Zendy

Nojima M. | Zendy; Fujii M. | Zendy; Kakuhara Y. | Zendy; Tsuchiya H. | Zendy; Kameyama A. | Zendy; Yokogawa S. | Zendy; Owari M. | Zendy; Nihei Y. | Zendy

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Failure analysis of fine Cu patterning by shave‐off profiling

Author(s) -

Nojima M.,

Fujii M.,

Kakuhara Y.,

Tsuchiya H.,

Kameyama A.,

Yokogawa S.,

Owari M.,

Nihei Y.

Publication year - 2011

Publication title -

surface and interface analysis

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.52

H-Index - 90

eISSN - 1096-9918

pISSN - 0142-2421

DOI - 10.1002/sia.3396

Subject(s) - chip , profiling (computer programming) , nanotechnology , materials science , chemistry , computer science , telecommunications , operating system

We focused on failure within fine copper patterning on a semiconductor chip. Three grades of samples were prepared; hard CMP treatment, soft CMP treatment and standard, and compared the differences by shave‐off profiling. The shave‐off profiles of CMP treatment revealed a saw‐toothed structure, and the shave‐off profile of a standard chip was revealed as a periodic triangular wave. The difference can be explained by the existence of residue on the CMP process. Copyright © 2010 John Wiley & Sons, Ltd.

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