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Fabrication and anti‐corrosion property of superhydrophobic hybrid film on copper surface and its formation mechanism
Author(s) -
Chen Yan,
Chen Shougang,
Yu Fei,
Sun Weiwei,
Zhu Haiying,
Yin Yansheng
Publication year - 2009
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.3102
Subject(s) - copper , contact angle , corrosion , dielectric spectroscopy , adsorption , materials science , fabrication , polarization (electrochemistry) , chemical engineering , anti corrosion , substrate (aquarium) , electrochemistry , immersion (mathematics) , nanotechnology , metallurgy , composite material , chemistry , organic chemistry , electrode , medicine , alternative medicine , oceanography , mathematics , pathology , pure mathematics , engineering , geology
Compact and uniform superhydrophobic films were prepared on copper substrates using one‐step solution‐immersion process, and the appropriate preparation conditions were selected for mixed solutions. SEM shows that the hybrid film of 1‐dodecanethiol and tetradecanoic acid on copper substrate is more compact with the contact angle of 160°. The electrochemical impedance spectroscopy and polarization test demonstrate that the anti‐corrosion property of surface‐modified copper substrate is greatly improved, especially for the hybrid film. Moreover, the competitive adsorption process and adsorptive geometry of hybrid film were well explained based on the results of quantum chemistry calculations, SEM, and energy dispersive X‐ray analysis. Copyright © 2009 John Wiley & Sons, Ltd.