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Inter‐diffusion effects in as‐deposited Al/Ni polycrystalline multi‐layers
Author(s) -
Salou M.,
Rioual S.,
Ben Youssef J.,
Dekadjevi D. T.,
Pogossian S. P.,
Jonnard P.,
Le Guen K.,
Gamblin G.,
Rouvellou B.
Publication year - 2008
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.2896
Subject(s) - x ray photoelectron spectroscopy , crystallite , sputtering , amorphous solid , stoichiometry , materials science , analytical chemistry (journal) , sputter deposition , aluminide , diffusion , diffraction , crystallography , metallurgy , chemistry , thin film , intermetallic , chemical engineering , nanotechnology , alloy , optics , thermodynamics , physics , chromatography , engineering
Al/Ni multi‐layers, deposited by magnetron sputtering at room temperature have been studied by complementary techniques; XPS, sputter depth profiling, electron‐induced X‐ray emission spectroscopy (XES) and X‐ray diffraction (XRD). XPS depth profile technique evidenced an atomic diffusion dominated by Ni atoms. Moreover, the Ni diffusion results in the formation of an amorphous phase with a stoichiometry close to the Al 3 Ni aluminide. Copyright © 2008 John Wiley & Sons, Ltd.