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TOF‐SIMS depth profiling study of corrosion propagation in coated hollow spheres
Author(s) -
Oriňáková Renáta,
Oriňák Andrej,
Arlinghaus Heinrich F.,
Hellweg Sebastian,
Kupková Miriam,
Strečková Magdaléna
Publication year - 2006
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.2207
Subject(s) - materials science , corrosion , copper , coating , metallurgy , porosity , metal , secondary ion mass spectrometry , layer (electronics) , composite material , cementation (geology) , ion , chemistry , organic chemistry , cement
Metallic foams and cellular materials prepared by sintering hollow metallic particles belong to the relatively new group of materials with extremely low density and extraordinary combination of mechanical, electrical, thermal and acoustic properties. Electrochemical deposition of metallic coatings on the surface of hollow spherical particles facilitates the required modification of the surface corresponding to high mechanical quality. Copper hollow spheres were obtained from porous iron powder particles by a cementation process. The suitable matrix for the preparation of relatively light but mechanically strong porous materials was obtained by electrochemically plating hollow copper microparticles by a Ni layer. The propagation of corrosion throughout the coated copper particles was examined. In this study, time‐of‐flight secondary ion mass spectrometry (TOF‐SIMS) depth profiling was used to investigate the distribution of the coating components and corrosion products across the surface and on the subsurface layer of coated hollow particles. Fe hollow particles were examined as a reference system. Our observations indicate that the corrosion results in metallic (Fe, Ni, Cu) oxidic, hydroxidic and chloridic species in the corroded substrate. Significant content of iron as well nickel and copper was registered on the outer surface layer after the corrosion test. Copyright © 2006 John Wiley & Sons, Ltd.