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Radio frequency (r.f.) plasma‐deposited polymer films: influence of external plasma parameters as viewed by comprehensive in‐situ surface chemical analysis by XAS, XPS and ToF‐SIMS
Author(s) -
Unger W. E. S.,
Swaraj S.,
Oran U.,
Lippitz A.
Publication year - 2006
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.2158
Subject(s) - x ray photoelectron spectroscopy , xanes , analytical chemistry (journal) , x ray absorption spectroscopy , secondary ion mass spectrometry , chemistry , plasma , thin film , absorption spectroscopy , absorption (acoustics) , chemical state , materials science , chemical engineering , spectroscopy , mass spectrometry , nanotechnology , organic chemistry , composite material , optics , physics , chromatography , quantum mechanics , engineering
The formation of plasma‐deposited materials made from organic molecules is a technologically attractive way to obtain films with unique properties, e.g. adhesion, wettability, conductivity or selected chemical functionalization. A detailed chemical characterization of these films is a great challenge for the analyst because of the co‐existence of a large number of chemical species in plasma‐deposited films. We investigated these types of organic films using photoelectron spectroscopy for chemical analysis (ESCA, XPS), near edge X‐ray absorption fine structure (NEXAFS) spectroscopy at synchrotron radiation source BESSY II and time‐of‐flight secondary ion mass spectroscopy (ToF‐SIMS). A dedicated plasma preparation chamber was designed and added to the main analysis chamber of the respective spectrometers. This approach offers the possibility of studying plasma‐deposited films without exposure to air before analysis (often called in‐situ analysis) and the influence of post‐plasma reactions, i.e. the ageing process. The present investigations are aimed at finding correlations between basic chemical properties of the deposited films and the plasma deposition parameters, e.g. duty cycle in pulsed plasmas and the power of discharge. Copyright © 2006 John Wiley & Sons, Ltd.