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Carbon film growth on iron substrates by a CVD method
Author(s) -
Ding YunShuang,
Li WeiNa,
Shen XiongFei,
Galasso Francis S.,
Suib Steven L.,
DiCarlo Joe
Publication year - 2005
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.2021
Subject(s) - raman spectroscopy , auger electron spectroscopy , carbon film , carbon fibers , chemical vapor deposition , scanning electron microscope , transmission electron microscopy , materials science , analytical chemistry (journal) , substrate (aquarium) , layer (electronics) , chemical engineering , deposition (geology) , thin film , nanotechnology , chemistry , composite material , optics , organic chemistry , physics , oceanography , engineering , geology , composite number , nuclear physics , paleontology , sediment , biology
Carbon film coatings have been produced by a hot‐wall chemical vapor deposition (CVD) method under moderate conditions from pyrolysis of a mixture of propane and argon on an Fe(110) substrate at temperatures of 800–900 °C for different deposition times. The effects of temperature and reaction time on the growth of the carbon films were studied. Field‐emission scanning electron microscopy (FESEM), Raman microscopy, Auger electron spectroscopy (AES) and x‐ray diffraction methods have been performed to study the surface morphologies, growth features and microstructures of the carbon film coatings. The FESEM analyses indicated that carbon films on an Fe substrate consisted of flat‐layer and filamentous morphologies. Raman and AES analyses showed that the carbon initially was crystalline but the degree of disorder in the top layer of the carbon film increased with increasing deposition temperature. High‐resolution transmission electron microscopy studies are also in agreement with Raman results. The same trend was observed when the deposition time was increased from 5 to 30 min. Copyright © 2005 John Wiley & Sons, Ltd.

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