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Electropolymerization of DBSA‐doped polypyrrole films on PTFE via an electroless copper interlayer
Author(s) -
Prissanaroon W.,
Brack N.,
Pigram P. J.,
Liesegang J.
Publication year - 2003
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.1634
Subject(s) - polypyrrole , x ray photoelectron spectroscopy , materials science , contact angle , chemical engineering , polymer chemistry , copper , thin film , dodecylbenzene , substrate (aquarium) , silanization , nanotechnology , composite material , polymerization , polymer , metallurgy , oceanography , sodium , engineering , geology , sulfonate
Abstract We report on the electroless deposition of thin films of copper on poly(tetrafluoroethylene) (PTFE) and their use as substrates for electropolymerization of polypyrrole. Argon plasma‐treated PTFE films were modified by silanization using N ‐[3(trimethoxysilyl)propyl]diethylenetriamine (TMS). The TMS‐modified PTFE films were subsequently activated by PdCl 2 for the electroless deposition of copper. The omission of the commonly used SnCl 2 sensitization step represents a significant process enhancement with environmental and cost benefits. The surface composition of the substrate (before and after surface treatments) and overlayer films was studied using high‐resolution x‐ray photoelectron spectroscopy. A combination of time‐of‐flight secondary ion mass spectrometry and water contact‐angle measurements was also used to study the PTFE surface after argon plasma treatment. The Cu/PTFE films were used as substrates for subsequent pyrrole electropolymerization in aqueous dodecylbenzene sulphonic acid (DBSA) solution. The DBSA‐doped polypyrrole overlayers were successfully deposited on the Cu/PTFE surface using a constant applied potential of 1.5 V. The resulting material exhibited a doping level of 39%, determined using chemical component analysis of the N 1s photoelectron peak. Copyright © 2003 John Wiley & Sons, Ltd.