Formation of a tetragonal Cu 3 Au alloy at gold/copper interfaces | Zendy

Sarkar Subhendu | Zendy; Datta Alokmay | Zendy; Chakraborty Purushottam | Zendy; Satpati Biswarup | Zendy

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Formation of a tetragonal Cu 3 Au alloy at gold/copper interfaces

Author(s) -

Sarkar Subhendu,

Datta Alokmay,

Chakraborty Purushottam,

Satpati Biswarup

Publication year - 2003

Publication title -

surface and interface analysis

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.52

H-Index - 90

eISSN - 1096-9918

pISSN - 0142-2421

DOI - 10.1002/sia.1603

Subject(s) - copper , alloy , tetragonal crystal system , sputtering , transmission electron microscopy , materials science , amorphous solid , sputter deposition , high resolution transmission electron microscopy , analytical chemistry (journal) , electron diffraction , diffraction , crystallography , metallurgy , chemistry , crystal structure , thin film , nanotechnology , optics , physics , chromatography

A gold–copper alloy with a nominal composition of Cu 3 Au but with a tetragonal ( c = 4 a ) structure is observed to form at Au/Cu interfaces of gold/copper multilayers deposited on amorphous substrates by d.c. magnetron sputtering. The formation of this non‐equilibrium structure (tentatively D 0 23 ) under‐ambient conditions is detected by secondary ion mass spectrometry, x‐ray diffraction and high‐resolution cross‐sectional transmission electron microscopy. Co‐sputtering of Au and Cu under similar conditions produces only conventional fcc Cu 3 Au alloy phases, suggesting that interfacial confinement plays a significant role in producing the novel Cu 3 Au alloy phase in gold/copper multilayers. Copyright © 2003 John Wiley & Sons, Ltd.

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