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Novel floating‐type low‐energy ion gun for high‐resolution depth profiling in ultrahigh vacuum
Author(s) -
Mizuhara Y.,
Kato J.,
Nagatomi T.,
Takai Y.,
Aoyama T.,
Yoshimoto A.,
Inoue M.,
Shimizu R.
Publication year - 2003
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.1545
Subject(s) - ion , sputtering , analytical chemistry (journal) , microprobe , materials science , auger , resolution (logic) , chemistry , ion current , atomic physics , physics , nanotechnology , mineralogy , thin film , organic chemistry , chromatography , artificial intelligence , computer science
A floating‐type low‐energy ion gun (FLIG) has been developed for high‐resolution depth profiling in ultrahigh vacuum (UHV). This UHV‐FLIG allows Ar + ions of primary energy down to 50 eV to be provided with high current intensity. The developed UHV‐FLIG was sufficiently compact, being ∼30 cm long, to be attached to a commercial surface analytical instrument. The performance of the UHV‐FLIG was measured by attaching it to a scanning Auger electron microprobe (JAMP‐10, Jeol), the base pressure of which in the analysis chamber was ∼1 × 10 −7 Pa. The vacuum condition of ∼5 × 10 −6 Pa was maintained during operation of the UHV‐FLIG without a differential pumping facility. Current density ranged from 41 to 138 µA cm −2 for Ar + ions of primary energy 100–500 eV at the working distance of 50 mm. This ensures a sputtering rate of ∼10 nm h −1 with 100 eV Ar + ions for Si, leading to depth profiling of high resolution in practical use. Copyright © 2003 John Wiley & Sons, Ltd.