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Uses of SIMS three dimensional imaging to understand the relationships between grain boundary chemistry, orientation and intergranular degradation
Author(s) -
McIntyre N. S.,
Huctwith C. M.,
Taylor K. F.,
Keating E.,
Petersen N. O.,
Brennenstühl A. M.
Publication year - 2002
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.1187
Subject(s) - intergranular corrosion , grain boundary , stress corrosion cracking , secondary ion mass spectrometry , impurity , metallurgy , alloy , degradation (telecommunications) , corrosion , chemistry , analytical chemistry (journal) , materials science , mass spectrometry , microstructure , environmental chemistry , telecommunications , organic chemistry , chromatography , computer science
Secondary ion mass spectrometry (SIMS) image depth profiles have been made through grain structures on nickel alloy material that had displayed differing levels of intergranular stress corrosion cracking. The distributions of trace impurities, both within and outside the grain boundaries, are documented qualitatively through three‐dimensional imaging, and quantitatively through the use of cross‐correlation spectroscopy. Copyright © 2002 John Wiley & Sons, Ltd.