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Interface evolution and bond strength when diffusion bonding materials with stable oxide films
Author(s) -
Shirzadi A. A.,
Assadi H.,
Wallach E. R.
Publication year - 2001
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.1088
Subject(s) - diffusion , aluminium , diffusion bonding , oxide , transient (computer programming) , materials science , bond strength , phase (matter) , atomic diffusion , liquid phase , diffusion welding , aluminum oxide , aluminium oxide , interface (matter) , surface diffusion , bonding strength , bond , chemical physics , composite material , layer (electronics) , chemistry , metallurgy , thermodynamics , crystallography , computer science , adsorption , organic chemistry , adhesive , capillary number , capillary action , operating system , welding , physics , finance , economics
The effects of stable surface oxides on the interface morphologies and strengths of aluminium diffusion bonds are reviewed. Previous approaches, proposed to overcome problems with surface oxides when joining aluminium alloys and composites, are described and compared for both solid‐state diffusion bonding and conventional transient liquid‐phase diffusion bonding. Non‐conventional joining methods, particularly the new method of temperature‐gradient transient liquid‐phase diffusion bonding and its capability of producing high‐strength bonds reliably, also are considered. Copyright © 2001 John Wiley & Sons, Ltd.