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In situ STM studies on underpotential deposition of Sn on Au(100)
Author(s) -
Yan J. W.,
Tang J.,
Yang Y. Y.,
Wu J. M.,
Xie Z. X.,
Sun S. G.,
Mao B. W.
Publication year - 2001
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/sia.1003
Subject(s) - underpotential deposition , scanning tunneling microscope , in situ , transition metal , deposition (geology) , chemistry , metal , electrochemistry , crystallography , materials science , nanotechnology , metallurgy , electrode , cyclic voltammetry , catalysis , paleontology , biochemistry , organic chemistry , sediment , biology
We present in situ STM studies on Sn electrodeposition on Au(100) surfaces at underpotentials. The Sn under potential deposition (UPD) on Au(100) proceeds in three stages: the reversible submonolayer UPD; surface alloying; and alloying that extends to the bulk. The formation of the reversible submonolayer UPD proceeds in the form of clusters of ∼2 nm at potentials as early as 0.04 V. The surface alloying takes place at −0.04 V, which is evidenced by sudden immersion of the Sn clusters as well as significant changes of steps on the surface. The bulk alloying sets in at −0.3 V, which leads to rapid change of the surface morphology. The earlier set in of the surface and bulk alloying process is considered the result of enhanced interdiffusion of Sn and Au atoms upon decreasing the potential. It has been shown that Sn UPD on Au(100) is much more complex than that of other metal UPD systems studied previously by electrochemical scanning tunnelling microscopy, but it serves as a good system for all‐sided studies of the UPD processes. Copyright © 2001 John Wiley & Sons, Ltd.