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P‐16.16: Study on product adhesion characteristic of OGM
Author(s) -
Qi-di Wu,
Le Li,
Bi-sheng Li,
Wen-jin Fan,
Zong-jie Guo,
Jia-wei Xu,
Bao-ran Li,
Zhao Dong,
Zhi Zhang
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.15391
Subject(s) - lamination , adhesion , pickling , die (integrated circuit) , aluminium , production line , process (computing) , manufacturing engineering , process engineering , layer (electronics) , materials science , engineering drawing , computer science , engineering , mechanical engineering , metallurgy , composite material , operating system
This article in view of the OGM adhesion faqs, Metal Peeling, open channel and so on, to explore the influence factors of adhesion, designed to improve adhesion of the metal. Through different process and different lamination process validation, design verification plan.Starting from the basic theory of adhesion, combined with the actual production process, analysis may affect the product adhesion factor: OC pickling, black Decap, fluctuation, slow down and washing, NO Mask STRIP OC0.Top Mo thinning, skip Anneal, OC, RM herculean task, SION, OC migration, etc.Comparing different Metal material, lamination, the panel position design verification. Through the adhesion test, process validation concluded that the relevant impact factors in actual production, OC pickling, alloy product USES cancel Metal2 black bottom, design verification of pure aluminium products go line area adopts GND excavated W/S below 15/15, BD area adopts single layer Metal line design.In this paper, the result is mainly used in Touch.