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P‐13.2: Optimizing Pad Bending Structure Based on Numerical Simulation to Prevent Metal Line Crack
Author(s) -
Zhou Min,
Liu Yifei,
Huang Rong,
Cao Weiran,
Jing Xiaohong,
Hwang Jason
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.15359
Subject(s) - metal , materials science , bending , stress (linguistics) , radius , back end of line , composite material , layer (electronics) , line (geometry) , computer simulation , structural engineering , glue , mechanics , metallurgy , geometry , computer science , engineering , physics , linguistics , philosophy , computer security , mathematics
This article applied numerical simulation to prevent metal line crack failure under extreme pad bending radius like 0.35mm. In this study, the relationship between the metal stress and various thickness designs of pad bending layers such as UV Glue, Bank & PLN, ODH and PI was investigated. Furthermore, the effect of the neutral layer shift would be studied as well. The simulation result shows that either thinner UV or thicker ODH lowers the metal stress efficiently. However, PI shows an irregular relationship with the metal stress, and the influence of the bank thickness is not such obvious as others. After the layers thickness optimization, compared with the original design , metal stress in the optimized structure has been reduced by 67.21%, and the neutral layer gets closer to the metal line ( from 10.97μm to 0.62μm), which explains metal stress reduction.