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P‐6.12: Simulation and Analysis of Temperature Distribution and Reduction for LCM based on ANSYS
Author(s) -
Sun Yaxin,
Zhong Peng,
Sun Lingyu,
Zhao Chaoyue,
Liang Fei,
Hou Tingxiu,
Du Jingjun
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.15313
Subject(s) - workbench , cover (algebra) , enhanced data rates for gsm evolution , thermal analysis , materials science , reduction (mathematics) , thermal , mechanical engineering , engineering , physics , mathematics , thermodynamics , geometry , telecommunications , visualization
In this paper, based on ANSYS Workbench steady‐state thermal analysis, the results of temperature distribution of LCM (liquid crystal module) both under 22 °C and 75 °C are obtained. According to the simulation results: the maximum temperature with the LCM is about 40 °C, while the largest is 80 °C approximately if the ambient is 75 °C. In order to reduce the highest temperature for LCM, this paper decided to analysis the effect of heat conducting chip (HCC) and the cooling effect of ways for HCC attached to the back cover is also analyzed. For HCC is fully covered back cover, the largest temperature declined to around 77 °C and 38.9 °C respectively. And if the edge of HCC is 10‐mm width, the temperature also decreased by 2 °C, which is almost the same as HCC full attachment to back cover.