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P‐4.13: Application and Improvement Measures of Sink IC for Bezel‐less Mobile
Author(s) -
Yang Xinlan,
Wang Shijun,
Wang Jiguo,
Liu Yi,
Tai Yuke,
Ding Tengfei,
Wei Zhan,
Wang Yang,
Feng Bo,
Zhan Hongming,
Chen Xi,
Xue Hailin
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.15286
Subject(s) - heat sink , sink (geography) , indentation , image warping , computer science , engineering , mechanical engineering , operating system , artificial intelligence , cartography , geography
To satisfy the full‐screen display demand, we introduce the Sink IC to minimize the bezel of TFT‐LCD module. After study on IC design and optimization of the internal bumps, rationalized design has solved the bonding issues, warping deformation and uneven indentation of Sink IC. The application of Sink IC has promoted the bezel‐less mobile development and the COG precision, which will soon be threw into enterprise production. This essay discusses advantages of the new IC, bonding issues we are trying to solve, and the changes on the panel correspondingly to push Sink IC application in the volume production and display industry.