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P‐4.4: Path Planning Analysis of Pad Bending Process for the Full Screen OLED Panel
Author(s) -
Wu Di,
Liao Dunming,
Peng Wenjing,
Liu Yuanke
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.15277
Subject(s) - bending , process (computing) , structural engineering , materials science , bending stiffness , deformation (meteorology) , path (computing) , plastic bending , stress (linguistics) , composite material , mechanical engineering , computer science , engineering , linguistics , philosophy , programming language , operating system
In the pad‐bending process of the full‐screen panel, the metal wire in the bending area is easily broken due to deformation, and the occurrence of the break is related to the bending path. This paper analyzes the influence of different bending paths on the peak stress of the metal wire, determines the method to explore the reasonable path based on mathematical theory, and provides guidance for the pad‐bending process design, which can be used to improve the yield of pad‐bending process of OLED panels.