Premium
17.4: Invited Paper: Characterization and Failure Analysis of OLED devices by FIB/TEM Techniques
Author(s) -
Liu Binghai,
Tan Andrew,
Hua Younan,
Qiao Mingshen,
Li Xiaomin
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.15076
Subject(s) - oled , materials science , characterization (materials science) , optoelectronics , focused ion beam , nanoscopic scale , failure mechanism , nanotechnology , layer (electronics) , composite material , chemistry , ion , organic chemistry
In this paper, we reported the application of TEM‐based techniques for the physical characterization and failure analysis of OLED devices. By using our new FIB‐TEM techniques, we successfully identified nanoscale multilayered organic film stacks in OLED devices, enabling the failure root understanding of the dark emission of R pixels in an OLD device. Other two case studies presented in this work demonstrated the importance of the combination of plane‐view FIB‐TEM with cross‐section FIB‐TEM techniques, and the grain size analysis techniques by TEM for the failure analysis of the OLED devices.