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P‐35: An Analytical Method of Small‐Module Fracture Dropping Based on Finite‐Element Analysis
Author(s) -
Li Xiaohua,
Zhu Lei,
Guo Qing,
Zhou Wei,
Zhang Bingchuan
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14910
Subject(s) - fracture (geology) , finite element method , reliability (semiconductor) , glue , key (lock) , adhesive , computer science , path (computing) , structural engineering , product (mathematics) , materials science , reliability engineering , mechanical engineering , engineering , mathematics , composite material , power (physics) , physics , geometry , computer security , layer (electronics) , quantum mechanics , programming language
As the probability of fracture is very often during dropping. The fragment of TPM have effect on the reliability and yields of product. Therefore, it is obviously necessary to research the influent factors on fracture in RA dropping. In this paper, to finding out the main influent factors of fracture based on FEA and experimental verification, which could provide a key path to optimize design and solve problem. These main impact factors for instance silicon adhesive parameter, silver glue, gaps between BLU pet and cell, the cell milling, are parts of several factors by filtering.