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59‐2: Laser Reflow Soldering Technique for Mini/MicroLed Displays
Author(s) -
Wang Lili,
Wang Chuhang,
Liu Chao,
Dong Enkai,
Zhai Ming,
Sun Haiwei
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14811
Subject(s) - soldering , reflow soldering , materials science , laser beam welding , welding , laser , dip soldering , mechanical engineering , wave soldering , metallurgy , engineering , optics , physics
This paper studies the implementing method and technical advantages of line‐beam laser reflow soldering. Research shown that the laser reflow soldering is an extremely promising new technology which can not only improve the welding effect of chips, but also reduce the deformation of components and substrates.