Premium
10‐2: Study of an Ultra‐fast Photonic Soldering Technology without Thermal Damage in Display Module Package
Author(s) -
Ho Ming-jaan,
Li Yanlu,
Liu Likun,
Li Yang,
Gao Chunlan
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14624
Subject(s) - soldering , materials science , dip soldering , photonics , optoelectronics , thermal conduction , wave soldering , composite material
An ultra‐fast photonic soldering approach to be introduced in the display module package, which has great advantages in soldering low temperature and heat sensitive components, was demonstrated. The soldering and heat conduction process was verified. As a result, flexible substrate was successfully interconnected on the display panel by photonic soldering.