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10‐1: Invited Paper: An In Depth Comparison of Methods to Evaluate Bending Failure for Flexible Electronics
Author(s) -
Cordill Megan J.,
Kreiml Patrice
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14623
Subject(s) - bending , materials science , composite material , ultimate tensile strength , electronics , polyimide , yield (engineering) , tensile testing , flexural strength , structural engineering , electrical engineering , engineering , layer (electronics)
For flexible electrical systems there are no standardized evaluation methods or failure criteria. This study compares in‐situ and ex‐situ bending under similar conditions (2.5% tensile bending strain, 10,000 cycles) in combination with optical and electrical evaluation methods on a 135/50 nm thick Al/Mo bilayer on 125 μm polyimide material system. The results show that under most circumstances the two bending tests studied show inhomogeneous, but comparable damage distribution. The test of electrical conductivity is more meaningful than crack density, as similar crack densities may yield vastly different conductivities when reached with different cycle speeds.