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P‐10.2: Characteristic and hollowing‐out Pattern with Debonding Layer in Mechanical separation
Author(s) -
Wang Jing,
Yang Jing,
Wang Hejin,
Tian Hongwei,
Zhao Meng,
Liu Ming,
Liu Zheng,
Kao Shanchen
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14559
Subject(s) - materials science , polyimide , layer (electronics) , composite material , lift (data mining) , substrate (aquarium) , adhesion , oled , scratch , computer science , oceanography , data mining , geology
A thermo‐stable Debonding layer (DBL) is applied between the glass substrate and polyimide (PI) layer to weaken the adhesion. Through the investigation of the TFT characteristic after mechanical separation under different speed and digging conditions, the optimized process condition has been summarized for the mechanical lift off of the flexible OLED display to avoid inducing more defects.