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P‐6.2: A Defect Defense Approach of Integrated Database Based on Over‐Etched Defect
Author(s) -
Yang Cheng Yu,
Zhou Xingdong
Publication year - 2021
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/sdtp.14548
Subject(s) - cleanroom , aluminium , root cause analysis , contamination , undercut , root cause , process engineering , materials science , engineering , metallurgy , mechanical engineering , forensic engineering , reliability engineering , nanotechnology , ecology , biology
The aluminum line overetched defect might be called as undercut PR Hole, etc by different manufacturers. The defect of this case study mainly shows a hole found on the aluminum line after stripper process but there is no any tracable symptom before the ending of dry etch process. That is, it seems no means to prevent or to found the root cause. A defect defense approach via cleanroom air quality database based integrated with TFT manufacturing processes air sampling characteristics of manufacturing chemicals cleanroom circulation and air flow pattern is proposed to demostrate how to figure out the root cause of aluminum line overetched defect, which found after stripper. Via the aid of proposed approach, the analysis shows the defect arises from the cross contamination between photo PVD and stripper process and the cross contamination comes from manufacturing layout cleanroom circulation and air flow pattern.

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